Reflow Oven
SMT SOLDERING EQUIPMENT
S&M reflow ovens deliver precision thermal profiling for lead-free and leaded SMT assembly. From compact 8-zone air models to advanced 12-zone vacuum systems, our ovens support the full spectrum of PCB production — from consumer electronics to automotive-grade power modules.
Choose Your Reflow Oven
Select by heating zone count, atmosphere type, or production volume. All models feature PC+PLC control, PID temperature management, and MES integration capability.
Air Reflow Ovens — DS Series
Cost-effective air convection reflow for standard lead-free and leaded processes. Ideal for consumer electronics, industrial controls, and mid-volume SMT lines.
8-Zone Air Reflow Oven
Model: DS-0802 | Size: L5300×W1420×H1520mm | Power: 75KW total
Entry-level 8-zone oven for small-to-medium volume production. Supports PCB widths up to 400mm (610mm optional). Two-stage cooling.
10-Zone Air Reflow Oven
Model: DS-1003 | Size: L6567×W1420×H1520mm | Power: 95KW total
Mid-range 10-zone oven with three-stage cooling. Longer thermal tunnel for complex lead-free profiles. Suitable for mixed SMT/DIP production lines.
12-Zone Air Reflow Oven
Model: DS-1204 | Size: L7735×W1420×H1520mm | Power: 110KW total
High-throughput 12-zone oven with four-stage cooling. Maximum thermal control for complex multi-layer boards and high-density component placement.
Nitrogen Reflow Ovens — DS-N Series
Nitrogen atmosphere reflow for oxidation-sensitive components, fine-pitch devices, and lead-free processes requiring superior solder joint quality. Closed-loop N₂ control maintains oxygen levels below 1000ppm.
8-Zone Nitrogen Reflow Oven
Model: DS-0802-N | N₂ consumption: 25–30 m³/h | O₂ level: 300–1000ppm
8-zone nitrogen oven for precision components requiring oxidation protection. External chiller cooling for tighter thermal control.
10-Zone Nitrogen Reflow Oven
Model: DS-1003-N | N₂ consumption: 30–35 m³/h | O₂ level: 300–1000ppm
10-zone nitrogen oven with three-stage cooling. Optimal for 5G modules, automotive sensors, and fine-pitch BGA components requiring strict thermal profiles.
12-Zone Nitrogen Reflow Oven
Model: DS-1204-N | N₂ consumption: 35–40 m³/h | O₂ level: 300–1000ppm
12-zone nitrogen oven with four-stage cooling. Maximum thermal tunnel length for complex lead-free profiles on high-density automotive and industrial boards.
Vacuum Reflow Oven — VTS Series
Inline vacuum reflow for void-free solder joints in power electronics, automotive ECUs, and high-reliability applications. Combines nitrogen atmosphere with vacuum chamber for sub-1% void rates.
12-Zone Vacuum Reflow Oven
Model: VTS-1013-N | Vacuum: 10–100 Pa | Cycle: ≥25 sec
9+1+3 zone configuration (9 heating + 1 vacuum + 3 cooling). Servo-controlled vacuum chamber. Designed for power modules, IGBT, and automotive-grade assemblies.
Why Choose Vacuum Reflow?
- Eliminates voids in solder joints — critical for thermal management in power devices
- Servo-controlled vacuum chamber with nitrogen fast-release
- Independent flux recovery system in vacuum zone
- Supports PCB sizes up to 300×350mm
- Temperature range up to 350°C for high-Tm alloys
- Servo auto-width adjustment in vacuum zone
Need Help Selecting the Right Reflow Oven?
Our SMT engineers will recommend the optimal zone count, atmosphere type, and configuration for your production requirements.