PCB Buffer · Cooling · Model ZCLC-3
PCB Cooling Buffer ZCLC-3 for Post-Reflow Temperature Control
An active cooling buffer that reduces board temperature after reflow before AOI, handling, or downstream assembly. Helps protect components and stabilize inspection results.
| Model | ZCLC-3 |
| Function | Active cooling + buffering |
| Best For | Post-reflow, before AOI |
| Interface | SMEMA compatible |
| Integration | Inline SMT conveyor |
Technical Specifications
| Function | Active cooling and buffering to reduce PCB temperature before downstream stations |
| Cooling Method | Forced air cooling (configuration dependent) |
| PCB Width Range | 80 – 650 mm |
| PCB Length Range | 80 – 650 mm |
| Conveyor Height | 900 20 mm (SMEMA standard) |
| Interface | SMEMA compatible |
| Power Supply | 220V / 50Hz |
Optional Configuration
| Cooling Zone Length | Configurable cooling length based on temperature drop requirement |
| Fan / Airflow | Adjustable airflow and fan count options |
| Rail Width Adjustment | Manual adjustment or motorized width adjustment |
| Signal / Control | Tower light, buzzer alarm, and custom handshake integration on request |
Who This Buffer Fits Best
Before AOI
Reduce heat shimmer and improve inspection stability when boards exit reflow at high temperature.
Heat-Sensitive Assemblies
Lower temperature reduces risk during handling and downstream processes.
Throughput Stability
Cooling + buffering smooths variations between reflow output and inspection/handling.
Compared with Standard Buffer
Cooling buffers add temperature control; standard buffers focus purely on line balancing.
Related Products
Need to Control Board Temperature After Reflow?
Tell us your reflow output temperature and the next station (AOI/handling). Well recommend the right cooling buffer configuration.