SMT Equipment for 5G & Industrial Control
High-reliability soldering for 5G base station infrastructure and industrial control electronics — complex multi-layer boards, mixed SMT/THT assembly.
5G and Industrial Electronics Requirements
5G base station boards and industrial controllers share demanding characteristics: high component density, multi-layer PCB construction, mixed SMT and through-hole assembly, and strict reliability requirements for continuous operation in harsh environments. These boards often combine fine-pitch RF components with heavy through-hole connectors, requiring both precision reflow and selective wave soldering.
Key Process Requirements
Complex Thermal Profiles
Multi-layer boards with diverse component types require many heating zones to achieve the correct thermal profile across all components simultaneously.
Mixed Assembly
RF connectors, power terminals, and other through-hole components on boards with dense SMT populations require selective wave soldering.
Lead-Free Compliance
5G and industrial equipment must comply with RoHS. Nitrogen atmosphere prevents oxidation during lead-free SAC305 processing.
Line Balancing
High-mix 5G production with varying board complexity requires buffer storage to balance cycle times between process steps.
Recommended Equipment
12-Zone Nitrogen Reflow Oven DS-1204-N
Maximum zone count for complex 5G board thermal profiles. Nitrogen atmosphere for lead-free compliance. 4-stage cooling for high-throughput lines.
Selective Wave Soldering SM-LII
Dual electromagnetic pump for precise through-hole connector soldering on mixed 5G assemblies. ±0.1mm positioning accuracy.
PCB Storage Buffer ZCL-3BLⅡ
65-layer × 2 board capacity for line balancing between process steps in high-mix 5G production. 30-second cycle time.
Configure Your 5G SMT Line
Our engineers will recommend the right equipment configuration for your 5G or industrial control board assembly requirements.