India · Large handling program · Project in production
Foxconn India PCB Handling Project
148 units: 2 dual-head 4 m shuttle systems, 10 cooling buffers, 23 OK/NG buffers, 8 shuttle systems, 2 flippers, 8 gate conveyors, and 95 custom single-track conveyors.
Configuration illustration. Actual equipment layout varies by project; project facts below come from verified internal records.
Project situation
The production plan covers a large mixed handling package rather than one standard conveyor. The line requires transfer, cooling, temporary storage, OK/NG separation, board flipping and operator access across several configurations.
Documented equipment configuration
The documented mix includes 4.0 m dual-screen dual-head shuttle equipment, 1 m cooling buffers, 1 m OK/NG buffers, 1.5 m shuttle equipment, flippers, gate conveyors and dust-covered custom link conveyors.
| Project status | In production |
|---|---|
| Equipment scope | 148 units: 2 dual-head 4 m shuttle systems, 10 cooling buffers, 23 OK/NG buffers, 8 shuttle systems, 2 flippers, 8 gate conveyors, and 95 custom single-track conveyors. |
| Destination | India · Large PCB handling program |
| Evidence basis | Customer order review, production plan, shipment/change record or repeat-order document. |
What the records verify
The source is a July-August 2026 production Gantt plan with design, sheet-metal, machining, procurement, assembly, electrical integration, debugging, quality inspection and shipping stages. The page is marked in production and does not claim completed delivery.
This case is published to show real project scope and configuration logic. Final equipment selection for another factory must still be checked against PCB size, process, target UPH, layout and utilities.
Related equipment and selection resources
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