10-Zone Air Reflow Oven DS-1003
The DS-1003 is a 10-zone air reflow oven engineered for mid-to-high volume SMT production lines. With 20 independently controlled heating zones (10 top + 10 bottom) and 3-stage forced-air cooling, it delivers precise thermal profiles with ±1°C uniformity across the full board width. Ideal for consumer electronics, telecom equipment, and industrial control board assemblies.
| Model | DS-1003 |
| Heating Zones | 10 (top) + 10 (bottom) = 20 zones |
| Cooling Zones | 3-stage forced air cooling |
| PCB Width | 50–400 mm (adjustable) |
| Temperature Uniformity | ±1°C |
| Total Power | 95 KW |
Full Technical Specifications
| Parameter | Specification |
| Model | DS-1003 |
| Heating Zones | 10 (top) + 10 (bottom) = 20 zones |
| Cooling Zones | 3-stage forced air cooling |
| Machine Dimensions | L6567 × W1420 × H1520 mm |
| Weight | 2750 kg |
| Total Power | 95 KW |
| Working Power | 15 KW |
| Temperature Range | 50–350°C |
| Temperature Uniformity | ±1°C |
| PCB Width | 50–400 mm (adjustable) |
| Conveyor Speed | 400–2000 mm/min |
| Conveyor Height | 900 ± 20 mm |
| Heating Method | Hot air convection |
| Atmosphere | Air |
Who Should Choose This Model?
The DS-1003 is the right choice for mid-to-high volume production lines that need more thermal precision than an 8-zone oven can provide, without the footprint or cost of a 12-zone system. It excels in consumer electronics, telecom equipment, and industrial control board assembly, and handles both lead-free and leaded reflow profiles with ease thanks to 20 independently controlled heating zones.
- vs. 8-Zone DS-0802: Two extra heating zones enable finer profile shaping through the preheat, soak, and reflow stages. The 3-stage cooling (vs. 2-stage on the 8-zone) supports faster throughput and tighter exit temperatures.
- vs. 12-Zone DS-1204: The DS-1003 has a more compact footprint (6567 mm vs. 7735 mm length) and lower power consumption (95 KW vs. 110 KW), making it the preferred choice when 10 zones are sufficient for your thermal profile requirements.
- Mixed profiles: Lines running both lead-free and leaded solder pastes benefit from the DS-1003’s flexible zone control, enabling quick recipe changeovers without sacrificing profile accuracy.
- Typical applications: Consumer electronics, telecommunications equipment, industrial control boards, and general SMT assembly with standard component density.
Related Products
8-Zone Air Reflow Oven DS-0802
Entry-level air reflow oven for standard-volume SMT lines. Compact 8-zone design with 2-stage cooling — ideal for lower-volume or space-constrained production floors.
12-Zone Air Reflow Oven DS-1204
Maximum thermal control for high-density, high-complexity PCB assemblies. 24 heating zones and 4-stage cooling for the most demanding air-atmosphere SMT production.
10-Zone Nitrogen Reflow Oven DS-1003-N
Same 10-zone thermal architecture as the DS-1003, enhanced with nitrogen atmosphere for lead-free soldering. Prevents oxidation on fine-pitch components and BGAs.
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