12-Zone Air Reflow Oven DS-1204
The DS-1204 is S&M’s highest-specification air reflow oven, built for high-volume, high-complexity PCB assemblies. With 24 independently controlled heating zones (12 top + 12 bottom) and 4-stage forced-air cooling, it delivers the finest thermal profile control available in an air-atmosphere system — ideal for automotive electronics, server boards, and densely populated multi-layer PCBs.
| Model | DS-1204 |
| Heating Zones | 12 (top) + 12 (bottom) = 24 zones |
| Cooling Zones | 4-stage forced air cooling |
| PCB Width | 50–400 mm (adjustable) |
| Temperature Uniformity | ±1°C |
| Total Power | 110 KW |
Full Technical Specifications
| Parameter | Specification |
| Model | DS-1204 |
| Heating Zones | 12 (top) + 12 (bottom) = 24 zones |
| Cooling Zones | 4-stage forced air cooling |
| Machine Dimensions | L7735 × W1420 × H1520 mm |
| Weight | 3300 kg |
| Total Power | 110 KW |
| Working Power | 20 KW |
| Temperature Range | 50–350°C |
| Temperature Uniformity | ±1°C |
| PCB Width | 50–400 mm (adjustable) |
| Conveyor Speed | 400–2000 mm/min |
| Conveyor Height | 900 ± 20 mm |
| Heating Method | Hot air convection |
| Atmosphere | Air |
Who Should Choose This Model?
The DS-1204 is the top-of-range air reflow oven for high-volume, high-complexity SMT production. Its 24-zone heating architecture gives process engineers the granular control required for boards with widely varied component thermal masses — from tiny 0201 passives to large BGAs and power components on the same board.
- Target applications: Automotive electronics, server and networking boards, multi-layer industrial PCBs, and any assembly where component mix demands a precisely shaped thermal profile.
- vs. 10-Zone DS-1003: Two additional zones on each axis allow finer profiling through the soak and reflow stages. 4-stage cooling (vs. 3-stage) lowers board exit temperature faster, enabling higher conveyor throughput and shorter cycle times.
- vs. Nitrogen models: When oxidation is not a concern for your solder paste and component specifications, the DS-1204 delivers equivalent thermal performance without the cost and logistics of nitrogen supply.
- Best for: EMS factories and OEM production lines running high-mix or high-volume air-atmosphere reflow with strict profile control requirements.
Related Products
10-Zone Air Reflow Oven DS-1003
The compact alternative for mid-to-high volume lines. 20 heating zones and 3-stage cooling — sufficient for most standard SMT assemblies at a lower footprint and power cost.
12-Zone Nitrogen Reflow Oven DS-1204-N
The DS-1204 with nitrogen atmosphere for lead-free and oxidation-sensitive assemblies. Same 24-zone architecture plus inert atmosphere protection for critical solder joints.
8-Zone Air Reflow Oven DS-0802
Entry-level air reflow oven for standard-volume SMT production. Compact, energy-efficient 8-zone design for lines that don’t require maximum zone count.
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