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REFLOW OVEN · MODEL DS-0802
8-Zone Air Reflow Oven
The DS-0802 is S&M’s entry-level 8-zone air convection reflow oven, designed for small-to-medium volume SMT production lines. With a compact 5.3-meter footprint and 75KW total power, it delivers reliable lead-free and leaded reflow performance for consumer electronics, industrial controls, and general SMT assembly.
Heating Zones: 8 top + 8 bottom
Cooling: 2-stage
PCB Width: 50-400mm (610mm opt.)
Temp Range: Room temp-300°C
Temp Accuracy: ±1°C
Cross-temp Variance: ±1.5°C
Transport Speed: 400-2000mm/min
Warm-up Time: ~25 min
Full Technical Specifications
| Category | Parameter | Specification |
|---|---|---|
| Physical | Dimensions (L×W×H) | 5300 × 1420 × 1520 mm |
| Physical | Net Weight | Approx. 2,200 kg |
| Power | Power Supply | 3-phase 5-wire / 380V / Cable ≥16mm² |
| Power | Total Power | 75 KW |
| Power | Startup Power | 40 KW (staged) |
| Power | Working Power | 12 KW |
| Thermal | Heating Zones | 8 top + 8 bottom |
| Thermal | Cooling Zones | 2-stage |
| Thermal | Temperature Range | Room temp – 300°C |
| Thermal | Temperature Accuracy | ±1°C |
| Thermal | Cross-section Variance | ±1.5°C |
| Thermal | Warm-up Time | ~25 minutes |
| Thermal | Cooling Method | Industrial fan rapid cooling |
| Transport | PCB Width Range | 50–400mm (optional: 50–610mm) |
| Transport | Component Height | 22mm above / 25mm below board |
| Transport | Transport Speed | 400–2000 mm/min |
| Transport | Rail Height from Floor | 900 ± 15mm |
| Transport | Transport Direction | Left-to-right (right-to-left optional) |
| Transport | Rail Adjustment | Electric auto-width |
| Control | Control System | PC + PLC + PID; Windows 10+; EN/CN switchable |
| Control | Temperature Control | PID closed-loop + SSR drive |
| Control | Alarm System | Temp deviation, speed deviation, airflow fault, board drop, power failure |
| Control | Access Control | 2-level password (programming / maintenance) |
| Ventilation | Exhaust Volume | 15 m³/min × 2 channels |
| Options | MES Integration | One-touch width via MES, MES data exchange |
| Options | Central Support | Available |
| Options | Real-time Profiling | Live furnace temperature monitoring |
Who Should Choose the 8-Zone Air Reflow Oven?
Ideal Applications
- Consumer electronics assembly (smartphones, tablets, wearables)
- Industrial control boards and power supplies
- LED lighting PCB production
- Small-to-medium volume contract manufacturing (EMS)
- R&D and pilot production lines
- Standard lead-free (SAC305) and leaded (Sn63Pb37) processes
DS-0802 vs. Larger Models
- vs. 10-zone (DS-1003): The 8-zone is 1.2m shorter and 20KW less power — choose it when floor space and energy cost matter more than thermal profile flexibility
- vs. Nitrogen models: Air convection is sufficient for standard SAC305 — choose nitrogen only when component oxidation sensitivity requires it
- vs. Vacuum (VTS-1013-N): Choose the DS-0802 when void-free joints are not a specification requirement
Related Products
8-Zone Nitrogen Reflow Oven
Same zone count with nitrogen atmosphere for oxidation-sensitive components
10-Zone Air Reflow Oven
Longer thermal tunnel for complex profiles and higher throughput
Inline PCB Loader
Automated board feeding for your reflow oven line
Request a Quote for the DS-0802
Tell us your production volume, PCB dimensions, and process requirements. Our engineers will provide a detailed proposal within 24 hours.