10-Zone Nitrogen Reflow Oven DS-1003-N
The DS-1003-N combines 10-zone thermal precision with nitrogen atmosphere soldering — the most popular nitrogen reflow oven in the S&M lineup for mid-to-high volume lead-free SMT production. Its 20 independently controlled heating zones (10 top + 10 bottom), external water-cooled chiller, and adjustable O2 levels (300–1000 ppm) make it the ideal balance of performance, N2 efficiency, and production throughput for EMS factories running mixed product types.
| Model | DS-1003-N |
| Heating Zones | 10 (top) + 10 (bottom) = 20 zones |
| Cooling | External chiller (water-cooled) |
| PCB Width | 50–400 mm (adjustable) |
| Temperature Uniformity | ±1°C |
| Oxygen Level | 300–1000 ppm (adjustable) |
Full Technical Specifications
| Parameter | Specification |
| Model | DS-1003-N |
| Heating Zones | 10 (top) + 10 (bottom) = 20 zones |
| Cooling Zones | External chiller cooling (water-cooled) |
| Machine Dimensions | L6567 × W1650 × H1520 mm |
| Weight | 2900 kg |
| Total Power | 95 KW |
| Working Power | 15 KW |
| Temperature Range | 50–350°C |
| Temperature Uniformity | ±1°C |
| PCB Width | 50–400 mm (adjustable) |
| Conveyor Speed | 400–2000 mm/min |
| Nitrogen Consumption | 30–35 m³/h |
| Oxygen Level | 300–1000 ppm (adjustable) |
| Atmosphere | Nitrogen (N2) |
Who Should Choose This Model?
The DS-1003-N is the most popular nitrogen reflow oven in the S&M range — chosen by EMS factories and contract manufacturers running mid-to-high volume lead-free SMT production with mixed product types. It offers the best balance of zone count, nitrogen efficiency, and machine footprint for most nitrogen-atmosphere production lines.
- Target industries: Telecommunications, industrial electronics, automotive suppliers, and EMS factories producing mixed-product assemblies where lead-free alloys (SAC305, SAC405) and inert atmosphere are required.
- Fine-pitch and BGA production: The combination of 20 heating zones and nitrogen atmosphere ensures precise temperature control and oxidation-free reflow for QFNs, CSPs, and ball grid arrays.
- vs. N2 8-Zone DS-0802-N: Two additional heating zones (20 vs. 16 total) provide better thermal profile control through the soak and reflow stages. N2 consumption is moderately higher (30–35 vs. 25–30 m³/h), but the thermal precision gain is significant for complex boards.
- vs. N2 12-Zone DS-1204-N: More compact machine (L6567 vs. L7735 mm), lower N2 consumption (30–35 vs. 35–40 m³/h), and lower capital cost. Sufficient for the vast majority of nitrogen-atmosphere SMT assemblies.
- Most popular nitrogen model for EMS factories running high-mix SMT lines with both standard and complex PCB types.
Related Products
8-Zone Nitrogen Reflow Oven DS-0802-N
Entry-level nitrogen reflow for smaller production lines and R&D labs. Compact footprint with 16 heating zones and lower N2 consumption for cost-efficient inert atmosphere soldering.
12-Zone Nitrogen Reflow Oven DS-1204-N
Flagship nitrogen reflow for the most demanding lead-free assemblies. 24 heating zones and 4-stage water-cooled cooling for maximum thermal control and throughput.
10-Zone Air Reflow Oven DS-1003
The air-atmosphere version of the DS-1003-N. Same 10-zone thermal architecture without the nitrogen system — choose this when atmosphere control is not required.
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