12-Zone Nitrogen Reflow Oven DS-1204-N | S&M SMT Equipment

12-Zone Nitrogen Reflow Oven DS-1204-N

12-Zone Nitrogen Reflow Oven DS-1204-N

The DS-1204-N is S&M’s flagship nitrogen reflow oven — engineered for Tier-1 EMS factories and OEM manufacturers with zero-defect soldering requirements. Combining 24 independently controlled heating zones (12 top + 12 bottom) with nitrogen atmosphere and external water-cooled chiller cooling, it delivers the maximum thermal profile precision available for high-complexity lead-free SMT production, including automotive ECUs, server motherboards, and power electronics.

ModelDS-1204-N
Heating Zones12 (top) + 12 (bottom) = 24 zones
CoolingExternal chiller (water-cooled)
PCB Width50–400 mm (adjustable)
Temperature Uniformity±1°C
Oxygen Level300–1000 ppm (adjustable)

Full Technical Specifications

ParameterSpecification
ModelDS-1204-N
Heating Zones12 (top) + 12 (bottom) = 24 zones
Cooling ZonesExternal chiller cooling (water-cooled)
Machine DimensionsL7735 × W1650 × H1520 mm
Weight3500 kg
Total Power110 KW
Working Power20 KW
Temperature Range50–350°C
Temperature Uniformity±1°C
PCB Width50–400 mm (adjustable)
Conveyor Speed400–2000 mm/min
Nitrogen Consumption35–40 m³/h
Oxygen Level300–1000 ppm (adjustable)
AtmosphereNitrogen (N2)

Who Should Choose This Model?

The DS-1204-N is the flagship nitrogen reflow oven for manufacturers where both maximum thermal precision and inert atmosphere protection are required simultaneously. It is the preferred choice for Tier-1 EMS factories, automotive electronics suppliers, and server/networking board manufacturers with the most demanding quality standards.

  • Highest-complexity lead-free assemblies: Automotive ECUs, server motherboards, power modules, and any board with extremely varied component thermal masses — large power components alongside 0201 passives and fine-pitch ICs.
  • Zero-defect requirements: The combination of 24 heating zones and nitrogen atmosphere minimizes solder defects (bridging, voiding, dewetting) to the lowest achievable level without a vacuum chamber.
  • vs. N2 10-Zone DS-1003-N: Two additional zones (24 vs. 20 total) give finer control through every stage of the thermal profile. Higher N2 consumption (35–40 vs. 30–35 m³/h) and longer machine footprint (L7735 vs. L6567 mm) are the trade-offs for maximum profile capability.
  • vs. Vacuum Reflow VTS-1013-N: The DS-1204-N offers higher throughput (continuous conveyor vs. vacuum cycle time) at lower capital and operating cost. Choose the DS-1204-N when solder void elimination is not required by your quality specification.
  • Tier-1 EMS standard: The DS-1204-N is S&M’s recommended configuration for contract manufacturers with strict customer quality audits and IPC Class 3 assembly requirements.

Related Products

10-Zone Nitrogen Reflow Oven DS-1003-N

The most popular nitrogen reflow model — 20 zones, external chiller cooling, and lower N2 consumption. Ideal for EMS factories where 10-zone precision is sufficient.

View Details →

Vacuum Reflow Oven VTS-1013-N

When nitrogen alone isn’t enough — the VTS-1013-N adds servo-driven vacuum to eliminate solder voids in power modules, IGBTs, and automotive electronics.

View Details →

12-Zone Air Reflow Oven DS-1204

Same 24-zone thermal architecture in an air-atmosphere configuration. Lower operating cost when nitrogen atmosphere is not required by your process specification.

View Details →

Ready to Upgrade Your SMT Line?

Contact our engineering team for specifications, pricing, and lead times on the DS-1204-N. We respond within 24 hours.

Scroll to Top