8-Zone Nitrogen Reflow Oven DS-0802-N
The DS-0802-N brings nitrogen atmosphere soldering to an 8-zone platform — the ideal entry point for lead-free production lines where oxidation prevention is critical. With 16 independently controlled heating zones, water-cooled external chiller cooling, and adjustable oxygen levels down to 300–1000 ppm, it protects fine-pitch components and BGA solder joints throughout the reflow process. Well-suited for smaller production lines and R&D laboratories.
| Model | DS-0802-N |
| Heating Zones | 8 (top) + 8 (bottom) = 16 zones |
| Cooling | External chiller (water-cooled) |
| PCB Width | 50–400 mm (adjustable) |
| Temperature Uniformity | ±1°C |
| Oxygen Level | 300–1000 ppm (adjustable) |
Full Technical Specifications
| Parameter | Specification |
| Model | DS-0802-N |
| Heating Zones | 8 (top) + 8 (bottom) = 16 zones |
| Cooling Zones | External chiller cooling (water-cooled) |
| Machine Dimensions | L5300 × W1650 × H1520 mm |
| Weight | 2400 kg |
| Total Power | 75 KW |
| Working Power | 12 KW |
| Temperature Range | 50–350°C |
| Temperature Uniformity | ±1°C |
| PCB Width | 50–400 mm (adjustable) |
| Conveyor Speed | 400–2000 mm/min |
| Nitrogen Consumption | 25–30 m³/h |
| Oxygen Level | 300–1000 ppm (adjustable) |
| Atmosphere | Nitrogen (N2) |
Who Should Choose This Model?
The DS-0802-N is the entry-level nitrogen reflow oven for production lines where oxidation prevention is non-negotiable but volume requirements don’t yet justify a 10- or 12-zone nitrogen system. It’s the most compact and cost-efficient nitrogen reflow option in the S&M lineup.
- Lead-free alloys: Essential for SAC305, SAC405, and other lead-free solder pastes that are susceptible to oxidation during reflow. Nitrogen atmosphere maintains solder wettability and joint integrity.
- Fine-pitch and area-array components: Fine-pitch QFPs, QFNs, and BGAs benefit significantly from an inert atmosphere — reduced dewetting and bridging defects, improved cosmetic appearance of solder joints.
- R&D labs and pilot lines: Compact footprint (L5300 mm) and lower N2 consumption (25–30 m³/h) make this the economical choice for engineering labs running qualification builds and low-to-medium volume production.
- vs. Air 8-Zone DS-0802: Adds nitrogen atmosphere and external water-cooled chiller. Machine body is wider (W1650 vs. W1420 mm) to accommodate the sealed nitrogen tunnel. Choose this when solder joint quality or customer specification requires N2 atmosphere.
- vs. Nitrogen 10-Zone DS-1003-N: Smaller footprint and lower N2 consumption; suitable for lines that don’t require 10-zone thermal control. Step up to the DS-1003-N when more complex thermal profiles or higher throughput are needed.
Related Products
10-Zone Nitrogen Reflow Oven DS-1003-N
Step up to 10-zone nitrogen reflow for mid-to-high volume lead-free lines. Better thermal profile precision and slightly higher N2 throughput for more demanding assemblies.
8-Zone Air Reflow Oven DS-0802
The air-atmosphere counterpart to the DS-0802-N. Same 8-zone platform without the nitrogen system — lower operating cost for assemblies where atmosphere control is not required.
Vacuum Reflow Oven VTS-1013-N
When nitrogen alone isn’t enough — the VTS-1013-N adds a vacuum chamber to eliminate solder voids in power modules, IGBTs, and automotive electronics.
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