Curing Oven KL-600
High-capacity thermal curing for PCBs up to 600mm wide. Built for large-scale SMT lines handling automotive, server, and industrial boards requiring precise adhesive, underfill, and conformal coating cure.

Product Overview
The KL-600 is Sun & Mountain’s high-capacity inline curing oven for production lines handling large PCBs up to 600mm wide. Designed for manufacturers in automotive electronics, server board production, and large industrial control applications, the KL-600 provides the same ±5°C temperature uniformity and hot air convection heating as the KL-460 — scaled up to match higher throughput demands and wider board formats.
With ~20 KW total power and an adjustable conveyor speed of 200–2000 mm/min, the KL-600 can be precisely profiled for a wide range of adhesive and polymer cure requirements. It pairs naturally with the SA-610 wave soldering machine to form a complete, large-board mixed assembly line solution.
Key Highlights
- 600mm max PCB width — handles large automotive, server, and industrial boards
- 50–300°C temperature range — covers all standard and specialty curing profiles
- ±5°C temperature uniformity — reliable across full 600mm board width
- Hot air convection heating — even thermal distribution without hot spots
- 200–2000 mm/min conveyor speed — precise cure time control
- ~20 KW power — sufficient thermal mass for large boards and high volume
- Pairs with SA-610 — complete large-board mixed assembly line solution
Technical Specifications
| Parameter | Specification |
|---|---|
| Model | KL-600 |
| Max PCB Width | 600 mm |
| Temperature Range | 50–300°C |
| Temperature Uniformity | ±5°C |
| Conveyor Speed | 200–2000 mm/min |
| Heating Method | Hot air convection |
| Atmosphere | Air |
| Power (estimated) | ~20 KW |
Who Is the KL-600 For?
✅ Best For
- High-volume SMT lines with large PCBs up to 600mm wide
- Automotive electronics requiring wide-board curing
- Server boards and large industrial control panels
- Lines pairing the KL-600 with the SA-610 wave soldering machine
- Operations requiring maximum throughput on adhesive, underfill, or conformal cure
🔄 KL-600 vs KL-460
- PCB width: KL-600 handles up to 600mm vs 460mm for the KL-460
- Power: KL-600 uses ~20 KW vs ~15 KW — higher thermal capacity for larger boards and faster throughput
- Footprint: KL-600 requires more floor space — plan accordingly
- Choose KL-460 if your boards are under 460mm wide and floor space is limited
Recommended Line Configuration: KL-600 + SA-610
The KL-600 curing oven pairs naturally with the SA-610 wave soldering machine to create a complete wide-board mixed assembly line. Cure SMT adhesives in the KL-600 before the wave soldering pass, then use the SA-610 to solder through-hole components — all on boards up to 610mm wide.
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Ready to Specify the KL-600?
Our engineering team will help you confirm the KL-600 fits your line configuration, board dimensions, and curing material requirements.

