Curing Oven
Curing Oven KL-600
Tray-style vertical curing oven with 600mm width for medium-to-large PCB curing. 4-zone hot air recirculation system with PID闭环 control for consistent curing results across all board areas.
600mm Width
4-Zone Curing
High Capacity
Technical Specifications
| Model | KL-600 |
|---|---|
| Application | Consumer electronics dispensing, SMT贴片 curing |
| Machine Dimensions (L×W×H) | 2,250 × 1,800 × 2,150 mm |
| Weight | < 2,200 kg |
| Cleanliness Class | Class 100,000 |
| Temperature Range | Room temp – 200°C (adjustable) |
| Temperature Accuracy | ±1°C |
| Number of Zones | 4 zones |
| Heating Method | Hot air recirculation, dual-side blow, side return air |
| Control | PID closed-loop control + SSR drive |
| PCB Temp Deviation | ≤ ±3°C |
| Min Cycle Time | Set per product requirement |
| PCB Max Size | 650 (L) × 600 (W) mm |
| Rail Width Adjustment | 80–600 mm, auto-adjust |
| Product Flow | Left→Right (Optional: Right→Left) |
| Layer Spacing | 20 mm |
| Number of Layers | 30 layers × 2 |
| Conveyor Height | 950 ± 30 mm |
| Installed Power | 65 kW |
Optional Configuration
| UV / Thermal / Combined Curing | Available (confirm with sales) |
|---|---|
| Cooling / Exhaust | Available on request |
| SMEMA Interface | Optional upgrade |
| MES Integration | One-key width adjustment + MES data exchange (optional) |
Need a tailored configuration?
Share your PCB size, line layout, and throughput requirement. We respond with a detailed proposal within 1 business day.