Curing Oven KL-600 | High-Capacity UV/Thermal Curing | S&M

Curing Oven KL-600

High-capacity thermal curing for PCBs up to 600mm wide. Built for large-scale SMT lines handling automotive, server, and industrial boards requiring precise adhesive, underfill, and conformal coating cure.

KL-600 Curing Oven

Product Overview

The KL-600 is Sun & Mountain’s high-capacity inline curing oven for production lines handling large PCBs up to 600mm wide. Designed for manufacturers in automotive electronics, server board production, and large industrial control applications, the KL-600 provides the same ±5°C temperature uniformity and hot air convection heating as the KL-460 — scaled up to match higher throughput demands and wider board formats.

With ~20 KW total power and an adjustable conveyor speed of 200–2000 mm/min, the KL-600 can be precisely profiled for a wide range of adhesive and polymer cure requirements. It pairs naturally with the SA-610 wave soldering machine to form a complete, large-board mixed assembly line solution.

Key Highlights

  • 600mm max PCB width — handles large automotive, server, and industrial boards
  • 50–300°C temperature range — covers all standard and specialty curing profiles
  • ±5°C temperature uniformity — reliable across full 600mm board width
  • Hot air convection heating — even thermal distribution without hot spots
  • 200–2000 mm/min conveyor speed — precise cure time control
  • ~20 KW power — sufficient thermal mass for large boards and high volume
  • Pairs with SA-610 — complete large-board mixed assembly line solution

Technical Specifications

ParameterSpecification
ModelKL-600
Max PCB Width600 mm
Temperature Range50–300°C
Temperature Uniformity±5°C
Conveyor Speed200–2000 mm/min
Heating MethodHot air convection
AtmosphereAir
Power (estimated)~20 KW

Who Is the KL-600 For?

✅ Best For

  • High-volume SMT lines with large PCBs up to 600mm wide
  • Automotive electronics requiring wide-board curing
  • Server boards and large industrial control panels
  • Lines pairing the KL-600 with the SA-610 wave soldering machine
  • Operations requiring maximum throughput on adhesive, underfill, or conformal cure

🔄 KL-600 vs KL-460

  • PCB width: KL-600 handles up to 600mm vs 460mm for the KL-460
  • Power: KL-600 uses ~20 KW vs ~15 KW — higher thermal capacity for larger boards and faster throughput
  • Footprint: KL-600 requires more floor space — plan accordingly
  • Choose KL-460 if your boards are under 460mm wide and floor space is limited

Recommended Line Configuration: KL-600 + SA-610

The KL-600 curing oven pairs naturally with the SA-610 wave soldering machine to create a complete wide-board mixed assembly line. Cure SMT adhesives in the KL-600 before the wave soldering pass, then use the SA-610 to solder through-hole components — all on boards up to 610mm wide.

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Ready to Specify the KL-600?

Our engineering team will help you confirm the KL-600 fits your line configuration, board dimensions, and curing material requirements.

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