SMT SOLDERING EQUIPMENT
S&M reflow ovens deliver precision thermal profiling for lead-free and leaded SMT assembly. From compact 8-zone air models to advanced 12-zone vacuum systems, our ovens support the full spectrum of PCB production — from consumer electronics to automotive-grade power modules.
What Reflow Solves in Your SMT Line
For Process Engineers
- Precise PID temperature control across all zones
- Configurable thermal profiles for lead-free (SAC305) and leaded alloys
- Closed-loop N2 atmosphere with O2 monitoring below 1000ppm
- MES integration for traceability and SPC data collection
- Nozzle cleaning and flux recovery systems to reduce downtime
For Procurement & Production Managers
- PC+PLC control — familiar industrial architecture, easy to maintain
- Modular heating zone design (8/10/12/13/15 zones) for flexible line matching
- Dual-track models enable simultaneous processing of two boards
- Wide-body options for PCB widths up to 510mm
- Global service network with 24-month warranty and spare parts stock
For High-Reliability Applications
- Vacuum reflow achieves sub-1% void rates for power electronics and IGBT modules
- Nitrogen atmosphere prevents oxidation of fine-pitch BGA and QFN pads
- Four-stage cooling for controlled solder joint solidification
- Supports high-Tm alloys up to 350C for automotive and aerospace assemblies
- ERP-accessible production data for complete lot traceability
DS Series — Air & Nitrogen Reflow Ovens
DS Series reflow ovens deliver ±1°C temperature stability across 8, 10, or 12 heating zones using PID-controlled convection heating, achieving stable thermal profiles for both leaded and lead-free solder alloys (SAC305, SAC405) in SMT assembly lines up to 400mm wide.
DS Air Series — Standard Convection
8-Zone Air Reflow Oven
Model: DS-0802 | Zones: 8 heating + 2 cooling | PCB Width: 400mm (610mm optional)
Entry-level 8-zone oven for small-to-medium volume production. Two-stage cooling. Proven platform for standard SMT lines.
10-Zone Air Reflow Oven
Model: DS-1003 | Zones: 10 heating + 3 cooling | PCB Width: 400mm (610mm optional)
Mid-range oven with longer thermal tunnel for complex lead-free profiles. Three-stage cooling. Suitable for mixed SMT/DIP production lines.
12-Zone Air Reflow Oven
Model: DS-1204 | Zones: 12 heating + 4 cooling | PCB Width: 400mm (610mm optional)
High-throughput oven with maximum thermal control for complex multi-layer boards and high-density component placement.
DS-N Series — Nitrogen Atmosphere
8-Zone Nitrogen Reflow Oven
Model: DS-0802-N | N2 consumption: 25-30 m3/h | O2 level: 300-1000ppm
8-zone nitrogen oven for precision components requiring oxidation protection. External chiller cooling for tighter thermal control.
10-Zone Nitrogen Reflow Oven
Model: DS-1003-N | N2 consumption: 30-35 m3/h | O2 level: 300-1000ppm
10-zone nitrogen oven with three-stage cooling. Optimal for 5G modules, automotive sensors, and fine-pitch BGA components.
12-Zone Nitrogen Reflow Oven
Model: DS-1204-N | N2 consumption: 35-40 m3/h | O2 level: 300-1000ppm
12-zone nitrogen oven with four-stage cooling. Maximum thermal tunnel length for complex lead-free profiles on high-density boards.
VS Series — Dual-Track, Wide-Body & Mesh Belt
VS Series reflow ovens process two PCBs simultaneously on independent conveyor lanes, delivering double the throughput of single-track models for high-volume SMT lines. Dual-track capability handles board widths from 70mm to 510mm with independent lane width adjustment, while wide-body and mesh-belt variants extend compatibility to oversized and hybrid SMT/DIP boards.
VS Dual-Track Air — Double Throughput
8-Zone Dual-Track Air Reflow
Model: VS-0802D | Lanes: 2 | PCB Width: 70-250mm per lane
10-Zone Dual-Track Air Reflow
Model: VS-1003D | Lanes: 2 | PCB Width: 70-250mm per lane
12-Zone Dual-Track Air Reflow
Model: VS-1204D | Lanes: 2 | PCB Width: 70-250mm per lane
VS Wide-Body & Mesh Belt
VS-1204W Wide-Body Air Reflow
Model: VS-1204W | PCB Width: up to 510mm | Zones: 12 heating + 4 cooling
VS-1003W Mesh Belt Air Reflow
Model: VS-1003W | Belt Type: Mesh belt | Zones: 10 heating + 3 cooling
VS-N Series — Nitrogen Dual-Track
8/10/12/13/15-zone dual-track with N2 atmosphere. Dual-lane throughput with oxidation protection.
VS-N Dual-Track Nitrogen — Model Range
VS-0802D-N
8-Zone Dual-Track N2 | O2: 300-1000ppm
VS-1003D-N
10-Zone Dual-Track N2 | O2: 300-1000ppm
VS-1204D-N
12-Zone Dual-Track N2 | O2: 300-1000ppm
VS-1204D-N2
12-Zone Dual-Track N2 High Flow | O2: <500ppm
VS-1303D-N
13-Zone Dual-Track N2 | O2: 300-1000ppm
VS-1504-N
15-Zone Dual-Track N2 | O2: 300-1000ppm
VTS Series — Vacuum Reflow Ovens
VTS vacuum reflow ovens achieve sub-1% void rates — compared to 5-15% voids in standard reflow — through servo-controlled vacuum chamber operation at 10-100 Pa, eliminating voids in power electronics, IGBT modules, and automotive-grade assemblies requiring void-free solder joints.
VTS-1013-N
Zones: 9 heating + 1 vacuum + 3 cooling | Vacuum: 10-100 Pa | Cycle: 25+ sec | PCB: up to 300x350mm
Flagship vacuum reflow oven. Servo-controlled vacuum chamber with nitrogen fast-release. Independent flux recovery system. For power modules, IGBT, and automotive-grade assemblies.
Why Choose Vacuum Reflow?
- Void elimination: Sub-1% void rates critical for thermal management in power devices
- Servo-controlled vacuum chamber with N2 fast-release for rapid cycle times (25+ sec per board)
- Independent flux recovery system in vacuum zone reduces consumable costs
- Temperature range up to 350C for high-Tm solder alloys in automotive and aerospace
- Servo auto-width adjustment in vacuum zone — no manual width setting required
- N2 atmosphere maintained throughout process for oxidation protection
- 9+1+3 zone configuration provides exceptional thermal uniformity
Best Applications for Vacuum Reflow
- Power modules (IGBT, MOSFET)
- Automotive ECUs and ADAS modules
- LED lighting (high-power LED)
- RF and microwave modules
- Aerospace electronics
- Medical power devices
ERS Series — High-End Nitrogen Reflow
ERS Series reflow ovens provide the highest zone density in the S&M lineup (10 heating + 4 cooling zones) with an extended thermal tunnel, enabling precise control of complex multi-layer board thermal profiles at oxygen levels below 1000 ppm for medical, automotive, and aerospace assembly.
ERS-1004N
Model: ERS-1004N | Zones: 10 heating + 4 cooling | Atmosphere: Nitrogen | O2 level: <1000ppm
Premium 10-zone nitrogen reflow with extended heating tunnel and four-stage cooling. For ultra-fine-pitch BGA, CSP, and 01005 assemblies in medical, automotive, and aerospace applications.
ERS Series Key Differentiators
- Extended thermal tunnel — longer soak zones for multi-layer boards with complex thermal mass
- Four-stage cooling with independent zone control for precise solidification profiles
- Ultra-low oxygen atmosphere (configurable below 500ppm) for maximum solder joint integrity
- PC+PLC with SPC software — real-time temperature deviation alerts and Cpk monitoring
- EMS/MES integration with JSON API and barcode traceability
- 24-month warranty with global on-site service coverage
How to Choose — Reflow Oven Selection Guide
| Your Requirement | Recommended | Why | Models |
|---|---|---|---|
| Standard consumer electronics, leaded processes | DS Air | Cost-effective, proven platform | DS-0802, DS-1003, DS-1204 |
| Fine-pitch BGA, QFN, 5G modules | DS-N Nitrogen | O2 below 1000ppm prevents oxidation | DS-0802-N through DS-1204-N |
| Two different boards simultaneously | VS Dual-Track | Double throughput, independent lanes | VS-0802D through VS-1504-N |
| Oversized PCBs (up to 510mm) | VS Wide-Body | Extended chamber width | VS-1204W |
| Hybrid SMT + DIP lines | VS Mesh Belt | Mesh belt handles mixed assembly | VS-1003W |
| Power modules, IGBT, void-free | VTS Vacuum | Sub-1% void rates, servo vacuum | VTS-1013-N |
| Automotive, aerospace, medical-grade | ERS Nitrogen | Extended tunnel, 4-stage cooling, SPC | ERS-1004N |
Certifications & Quality Assurance
CE
European Compliance
All S&M reflow ovens carry CE certification for EU market access.
ISO 9001
Quality Management
Manufacturing facility certified to ISO 9001:2015.
IATF 16949
Automotive Quality
Processes qualified for IATF 16949 automotive standard.
24-mo
Warranty & Support
24-month warranty with global spare parts and on-site service.
Frequently Asked Questions
CE
European Compliance
All S&M reflow ovens carry CE certification for EU market access.
ISO 9001
Quality Management
Manufacturing facility certified to ISO 9001:2015.
IATF 16949
Automotive Quality
Processes qualified for IATF 16949 automotive standard.
24-mo
Warranty & Support
24-month warranty with global spare parts and on-site service.
What zone count do I need for lead-free assembly?
Lead-free solder alloys (SAC305, SAC405) require higher peak temperatures and longer time above liquidus (TAL). For boards with complex thermal mass or high-density component placement, a minimum of 10 zones is recommended. Standard 8-zone models work well for simpler boards with mostly leaded processes. Automotive and multilayer boards typically need 12+ zones for adequate thermal control.
When is nitrogen atmosphere required?
Nitrogen atmosphere is recommended when: (1) assembling fine-pitch BGA or QFN components, (2) using no-clean flux where oxidation could affect probe testability, (3) producing LED modules where oxidation of silver pads causes brightness loss, or (4) any application where solder joint cosmetics and reliability are critical. Most standard SMT reflow for consumer electronics can use air atmosphere without issues.
What is the difference between DS and VS series?
DS Series is our standard single-track reflow oven lineup (8/10/12 zones, air or nitrogen). VS Series adds dual-track capability — two independent conveyor lanes that process two boards simultaneously. VS models can run two different board widths on each lane with independent width adjustment. For customers needing maximum throughput on smaller boards, VS dual-track effectively doubles effective production capacity.
Can the VTS vacuum reflow handle large power modules?
Yes. The VTS-1013-N supports PCB sizes up to 300x350mm. For power modules and IGBT assemblies that require void-free solder joints, the vacuum reflow process achieves sub-1% void rates compared to 5-15% voids typical with standard reflow. The VTS-1013-N operates at temperatures up to 350C for high-Tm solder alloys.
What integration options are available?
All S&M reflow ovens support MES integration via JSON API for production data collection, SPC monitoring, and lot traceability. SMEMA-compliant conveyor interfaces allow connection to upstream and downstream equipment. PC+PLC control software supports recipe management, temperature logging, and remote diagnostics. Optional barcode traceability enables full production history tracking by board serial number.
What is the typical delivery and installation timeline?
Standard models ship within 4-6 weeks of order confirmation. Installation and commissioning typically requires 3-5 working days on-site, including oven positioning, electrical connection (3-phase), nitrogen piping for N2 models, chiller setup, and thermal profiling with a golden board. IQ/OQ documentation available on request for pharmaceutical and medical device manufacturing customers.
Need Help Matching the Right Model to Your Line?
Our SMT application engineers will recommend the optimal zone count, atmosphere type, and configuration based on your PCB specs, production volume, and thermal profile requirements.