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Full Technical Specifications

Parameter	Specification
Model	VTS-1013-N
Zone Configuration	9 heating + 1 vacuum + 3 cooling zones
Vacuum Chamber Pressure	10–100 Pa (adjustable)
Vacuum Pump Flow	63–76 m³/h
Minimum Cycle Time	25 seconds
Machine Dimensions	L6567 × W1420 × H1520 mm
Weight	3400 kg
Total Power	100 KW
Working Power	13 KW
Temperature Range	50–350°C
Temperature Uniformity	±1°C
PCB Width	50–400 mm (adjustable)
Conveyor Speed	400–2000 mm/min
Atmosphere	Nitrogen (N2)
Vacuum Actuation	Servo motor driven

Who Should Choose This Model?

The VTS-1013-N is the definitive choice when solder void elimination is a hard quality requirement — not just a preference. The servo-driven vacuum chamber applies precisely controlled low pressure (10–100 Pa) at the peak reflow stage, collapsing gas bubbles in the solder paste before the joint solidifies. The result is void rates well below 2% — meeting or exceeding IPC-7711/7721 and automotive PPAP quality requirements.

• Power electronics: Power modules, IGBTs, MOSFETs, and diode assemblies where solder voids create thermal resistance hotspots that cause premature field failure under high current loads.
• Automotive electronics: ECUs, inverters, and battery management systems where void-free solder joints are required for AEC-Q100/Q101 qualification and functional safety standards.
• Advanced packaging: MiniLED direct backlight modules, semiconductor die attach, and wafer-level packaging where void content directly affects optical or electrical performance.
• vs. Nitrogen reflow (DS-1204-N): The VTS-1013-N adds a vacuum stage that nitrogen alone cannot replicate. Throughput is lower due to the vacuum cycle time (min. 25 seconds per board), but solder joint quality is in a different class. Choose vacuum when your quality specification requires it; choose the DS-1204-N when throughput is the priority.
• vs. Air reflow: The VTS-1013-N provides both nitrogen atmosphere AND vacuum void elimination — the highest achievable solder joint quality, at the highest capital investment. The right choice for zero-defect, safety-critical electronics manufacturing.
• Unique differentiator: The only model in the S&M lineup with servo-driven vacuum actuation — enabling precise, repeatable pressure control versus pneumatic competitors, with programmable vacuum ramp profiles for different solder paste and board configurations.

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