Selective Wave Soldering Machine SM-LII | Dual Electromagnetic Pump | S&M

Selective Wave Soldering Machine SM-LII

Dual electromagnetic pump selective soldering with ±0.1mm positioning accuracy. Designed for mixed assemblies where full-board wave soldering is not possible.

SM-LII Selective Wave Soldering Machine

Product Overview

The SM-LII is Sun & Mountain’s dual-pump selective wave soldering machine for high-mix production environments where standard full-board wave soldering is not viable. It uses two independent electromagnetic pumps to deliver precise point-by-point solder flow, targeting only the through-hole joints you specify — leaving adjacent SMT components untouched.

With ±0.1mm positioning accuracy and programmable soldering sequences, the SM-LII is ideal for boards with through-hole connectors, pin headers, or power components surrounded by SMT parts. The drop jet selective fluxer applies flux only to target areas, minimizing contamination and cleanup. Optional nitrogen atmosphere further improves joint quality for sensitive applications.

Key Highlights

  • Dual electromagnetic pumps — simultaneous or sequential multi-point soldering
  • ±0.1mm positioning accuracy — reliable targeting of tight-pitch through-hole components
  • 13kg per-pot capacity — compact solder pots with precise flow control
  • Drop jet fluxer — selective flux application to target zones only
  • Bottom IR preheat — controlled board heating without disturbing SMT components
  • Up to 610×610mm PCB — handles large mixed-assembly boards
  • Air or optional nitrogen — flexible atmosphere for different alloys and quality requirements

Technical Specifications

ParameterSpecification
ModelSM-LII
Machine DimensionsL2980 × W1910 × H1662 mm
Weight1800 kg
Total Power30 KW
Solder Pot Capacity13 kg (per pot)
Pump TypeDual electromagnetic pump
Positioning Accuracy±0.1 mm
Max PCB Size610 × 610 mm
Flux SystemDrop jet fluxer (selective)
Preheat MethodBottom IR preheat
AtmosphereAir or optional nitrogen

Selective vs. Full-Board Wave Soldering

Understanding when to choose selective soldering over a standard wave soldering machine.

FactorSM-LII SelectiveSA-350 / SA-450 / SA-610 Wave
Board typeMixed SMT + THTThrough-hole or simple SMT+THT
SMT components near THT✅ No problem — point soldering avoids SMT❌ Risk of SMT reflow or damage
Flux applicationSelective (drop jet) — target zones onlyFull-board spray fluxer
ThroughputLower (sequential points)Higher (one pass, full board)
Production volumeHigh-mix, low-to-mid volumeHigh-volume, consistent boards
Nitrogen option✅ AvailableAir atmosphere standard

Who Is the SM-LII For?

✅ Best For

  • Mixed assemblies where SMT components prevent full-board wave soldering
  • Through-hole connectors and pin headers on boards with nearby SMT components
  • High-mix, low-volume production requiring flexible, programmable soldering points
  • Tight-pitch through-hole components requiring ±0.1mm accuracy
  • Applications where nitrogen atmosphere improves joint quality

🔄 How It Compares

  • vs SA-350/450/610: SM-LII solders point-by-point; wave machines solder the full board in one pass — choose SM-LII when SMT components are adjacent to THT pads
  • Dual electromagnetic pumps: allows two solder points to be processed simultaneously, improving cycle time over single-pump selective machines
  • Drop jet fluxer: unlike spray fluxers on full-wave machines, applies flux only to target points, reducing residue and cleaning requirements

Related Products

Need Selective Soldering for Your Mixed Assembly?

Our applications team can review your board layout and recommend the optimal soldering strategy — selective, full-board wave, or a combination of both.

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