Selective Wave Soldering · Model SM-LII
Selective Wave Soldering Machine SM-LII for Higher Throughput
Dual electromagnetic pump selective soldering for higher throughput and flexible soldering coverage. Suitable for complex assemblies with larger soldering workload.
| Model | SM-LII |
| Process | Selective soldering |
| Pump | Dual electromagnetic |
| Best For | Higher soldering workload |
| Integration | Inline or standalone |
Technical Specifications
| Machine Dimensions | 2980(L)x1910(W)x1662(H) |
| Total Machine Power | 30kw |
| Power Supply | 3-Phase 5-Wire / 380V / Cable>=25 sq mm |
| Net Weight | 1800KG |
| Air Source Requirement | Pressure 0.4-0.6MPa |
| Nitrogen Source Requirement | Pressure 0.4-0.6MPa,Flow 1.5-2m3/hr/Solder Pot,Purity >=99.999% |
| Exhaust Air Requirement | RecommendationSpray area:>=10m3/Min;Solder Pot area:>=10m3/Min |
| Jig Through Size | L460xW460 mm |
| Max Soldering Area | L460xW460 mm |
| Control System | Industrial PC + Controller |
| Conveyor Width | 50-450 mm |
| Product Conveyor | 3 Independent Motor Conveyor; Spray、PreheatSection、Soldering Section Uses Roller Conveyor |
| PCB Conveyor Direction | Horizontal Conveyor(Left-to-Right or Right-to-Left) |
| Max Component Height | Top max=100mm / Bottom max=40mm |
| Conveyor Load | 15kg/station |
| Conveyor Height | 900+/-20mm |
| Conveyor Width Adjustment | Auto Width Adjustment |
| Motion Axes | X,Y |
| Motion Control | Servo Motor + Precision Ball Screw Module |
| Positioning Accuracy | +/-0.1mm |
| Flux Valve | Electronic Spray Valve x 1 |
| Flux Tank Capacity | Stainless Steel Pressure Tank,Capacity2L |
| SprayWidth | ~3-8mm |
| Preheat Method | Top Hot Air Preheat,Bottom IR Preheat,Soldering Zone IR Preheat |
| Preheat Rated Power | 21kw |
| Temperature Range | Ambient to 250degC |
| Motion Axes | X,Y,,Z1,Z2,W |
| Motion Control | Servo Motor + Precision Ball Screw Module |
| Positioning Accuracy | +/-0.1 mm |
| Solder Pot Type | Electromagnetic Pump x 2 |
| Solder PotCapacity | 13kg / Solder Pot |
| Solder Temperature Control | PID |
| Control Accuracy | +/-2degC |
| Tin Melting Time | Electromagnetic Pump ~60 Minutes |
| Solder PotTemperature | Ambient to 350degC |
| Solder Pot Heating Power | 1.5kw+150W |
| Solder Pot Coil Power | 400W |
| Standard Nozzle | 5 pcs x 2(Inner dia 3, 4, 6, 8, 10mm)/Customizable |
| Dross Generation | ~0.5KG/Solder Pot//Week |
| Nitrogen Consumption / Nozzle | ~1.5-2m3/hr/Solder Pot |
Optional Configuration
| MES | OptionalFunction |
| Barcode Scanning | OptionalFunction |
| UPS | OptionalFunction |
| Flux Nozzle Auto Monitoring Function | OptionalFunction |
| Auto Tin Feeding 、Auto NozzleCleaning Function | OptionalFunction |
| Equipment ConfigurationOxygen Analyzer | OptionalFunction |
Who This Machine Fits Best
Higher Throughput Selective
Dual pumps support more soldering work per cycle.
Complex Boards
Targeted soldering reduces defects without heavy masking.
Quality/Consistency
Precise control improves yield on difficult joints.
Compared with SM-LI
SM-LI is simpler; SM-LII is for higher soldering workload and throughput needs.
Related Products
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