Vietnam · Automotive electronics · Delivered equipment and repeat order

Foxconn Vietnam SMT Equipment Project

4 × TS-1203D-NEV 12-zone dual-track nitrogen reflow ovens; 140 × PTB-460-EV single-track cooling conveyors; 50 × PTB-D300-EV dual-track cooling conveyors; 4 × PGQ-1800/EV lift conveyors. A further TS-1203D-NEV order was placed in July 2026.

Foxconn Vietnam SMT Equipment Project configuration illustration

Configuration illustration. Actual equipment layout varies by project; project facts below come from verified internal records.

Delivered + repeat orderCurrent evidence status
VietnamDestination market
Verified scopeModels and quantities checked against project records
No invented KPIsNo unsupported yield, uptime or savings claims

Project situation

The documented program combines nitrogen reflow with a large volume of cooling and transfer equipment for Foxconn EV Energy & Component (Vietnam). The line interfaces required left-to-right flow and project-specific handling support.

Documented equipment configuration

The shipped program used TS-1203D-NEV dual-track nitrogen reflow ovens and 194 handling units. Post-delivery engineering follow-up addressed alert-tower visibility, alarm audibility, independent cooling-fan controls and operator-interface height.

Project status Delivered + repeat order
Equipment scope 4 × TS-1203D-NEV 12-zone dual-track nitrogen reflow ovens; 140 × PTB-460-EV single-track cooling conveyors; 50 × PTB-D300-EV dual-track cooling conveyors; 4 × PGQ-1800/EV lift conveyors. A further TS-1203D-NEV order was placed in July 2026.
Destination Vietnam · Automotive electronics
Evidence basis Customer order review, production plan, shipment/change record or repeat-order document.

What the records verify

Internal records identify the four ovens and 194 handling units as shipped equipment, including machine plate ranges. The July 2026 review confirms an additional 12-zone dual-track nitrogen oven order. No unsupported yield or capacity improvement is claimed.

This case is published to show real project scope and configuration logic. Final equipment selection for another factory must still be checked against PCB size, process, target UPH, layout and utilities.

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