Nitrogen Wave · Model SA-450N
SA-450N
Nitrogen wave soldering machine delivering reduced dross and superior solder joint quality.
| Model | SA-450N |
| Power | ~70KW |
Technical Specifications
| Power Supply | 3-Phase 5-Wire / 380V / Cable>=25 sq mm |
| Total Power | ~70KW |
| Startup Power | ~30KW |
| Operating Power | ~12KW |
| Control System | PC + PLC Control |
| Cooling Method | Cross-flow Fan |
| Exhaust Duct Diameter | Phi 195mm |
| SprayAir Pressure | 0.2Mpa~0.4Mpa |
| SprayMotion | Stepper Motor |
| Auto Flux Replenishment | Standard |
| Preheat Method | Micro-circulation Hot Air |
| PreheatTemperatureControl | PID |
| Temperature Range | Ambient ~200degC |
| TopPreheatZone & Insulation Cover | 2-stage Micro-circulation Hot Air(Tempered Glass Insulation Cover-Optionalitem) |
| BottomPreheatZone Count | 3-stage Micro-circulation Hot Air |
| Solder PotTemperature Control Method | PID |
| Solder Pot Heating Power | 18KW |
| Flat Wave Height | 15mm(Effective Wave Height) |
| Wave Height Adjustment | Variable Frequency + Digital Control |
| Solder Pot Type | Mechanical + Stainless Steel Flow Channel |
| Solder PotMaterial | Cast Iron Molding + Enamel Process |
| Solder Pot Loading Method | Manual Electric Operation In/Out |
| Solder PotCapacity | 500KG |
| Conveyor Direction | L-R/R-L |
| Conveyor Speed | 400-1800mm/min |
| Conveyor SpeedControl Method | VFD Closed-loop Stepless Speed Control |
| Conveyor Motor | 90W Fixed-speed Motor |
| Conveyor Rail Angle | 4~7degadjustable |
| WidthRange | 50mm~450mm |
| Conveyor Height | Inlet Height ~:750mm+/-50mm |
| Conveyor Rail/Track Load | 25Kg/M |
| Claw Cleaning System | Circulating Pipe + Brush |
| Claw Cleaning Motor | 220V 30W |
| Chain Finger Type | Dual Round Claws |
| Nitrogen Filling Distribution | Partial N2 Filling(Solder Pot); |
| Oxygen Analyzer | Single Channel |
| Nitrogen Consumption | 1000~10000 ppm,~15m3/h |
Optional Configuration
| Chain Finger Type (Optional) | (Optional:Heavy-duty Duck Claws) |
| Nitrogen Filling Distribution (Optional) | (Optional:Full-zone N2 Filling) |
| Management Authority Function | Programming, Debugging, 2-Level Password Authorization |
Who This Machine Fits Best
Fine-Pitch Assembly
Designed for BGA, QFN, and other fine-pitch components requiring precise thermal profiling.
Nitrogen Environment
Oxygen levels below 1000 ppm minimize oxidation and improve solder joint quality.
Dual-Track Option
Dual-track models support simultaneous processing of two independent panels.
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