Product Overview

The PCB Cooling Buffer ZCLC-3 cools boards actively while they travel through the buffer on a conveyor. Forced air is directed at the boards from above and below as they pass through, rapidly reducing their temperature before they reach the next station. Unlike the Cooling Storage Buffer ZCL-3BL which stores boards in layers during cooling, the ZCLC-3 cools boards in motion — making it a more compact solution for lines where storage capacity is not the primary requirement.

The ZCLC-3 is typically placed immediately after a reflow oven or wave soldering machine, where boards exit at temperatures that are too high for safe downstream handling, AOI scanning, or component placement. By integrating cooling into the buffer conveyor, it eliminates the need for a separate standalone cooling conveyor, saving floor space and reducing line complexity.

Key Highlights

• Active forced-air cooling in motion — cools boards while they travel through the buffer, not during storage
• Compact design — integrates cooling into the buffer conveyor, no separate cooling station needed
• Rapid temperature reduction — forced air from above and below for efficient heat dissipation
• SMEMA compatible — integrates with any standard SMT line equipment
• Adjustable rail width — accommodates a range of PCB sizes
• Adjustable airflow — cooling intensity can be tuned to board type and temperature requirements

Best For

• Placement immediately after a reflow oven or wave soldering machine
• Lines where boards must reach a specific temperature before AOI scanning or downstream handling
• Lines where floor space does not allow a separate standalone cooling conveyor
• Production of boards where rapid, controlled cooling is needed to prevent warping

How It Compares

• vs Cooling Storage Buffer ZCL-3BL: ZCL-3BL stores boards in layers and cools them during storage — higher capacity, more cooling time. ZCLC-3 cools boards in motion on a conveyor — more compact, faster throughput.
• vs Standard Buffer ZCL-3: Standard buffer provides no cooling. ZCLC-3 adds active forced-air cooling for boards exiting high-temperature processes.
• vs Standalone Cooling Conveyor: ZCLC-3 combines buffering and cooling in one unit, saving floor space compared to a separate cooling conveyor added to the line.